Organized
2023
[1] Technical Program Committee (TPC) member; Steering Committee member; TPC member, track: “Quantum, R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Lisbon, Portugal, Sept. 2023.
2022
[1] Technical Program Committee (TPC) member; R. B. Staszewski; IEEE VLSI Symposium on Circuits Conf. (VLSI), Kiyto, Japan, June 2022.
[2] Technical Program Committee (TPC) member; Analog Signal Processing Technical Committee (ASPTC); R. B. Staszewski; IEEE Symposium on Circuits and Systems (ISCAS); San Diego, CA, USA, May–1 Jun. 2022.
[3] Technical Program Committee (TPC) member; Steering Committee member; TPC member, track: “Quantum,” R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Milan, Italy, 19–22 Sept. 2022.
[4] Technical Program Committee (TPC) member; R. B. Staszewski; IEEE VLSI Symposium on Circuits Conf. (VLSI), Honolulu, HI, USA, 12–23 June 2022.
[5] Technical Program Committee (TPC) member; Analog Signal Processing Technical Committee (ASPTC); R. B. Staszewski; IEEE Symposium on Circuits and Systems (ISCAS); Austin, TX, USA, 28 May–1 Jun. 2022.
2021
[1] Technical Program Committee (TPC) member; Steering Committee member; TPC member, track: “Quantum,” R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Grenoble, France, 6–9 Sept. 2021. (Virtual)
[2] Technical Paper Review Committee (TPRC) member, Subcommittee 35; Quantum devices, systems, and applications, R. B. Staszewski; IEEE International Microwave Symposium (IMS). Georgia, Atlanta, USA, 6–11 June 2021.
[3] Technical Program Committee (TPC) member; R. B. Staszewski; IEEE VLSI Symposium on Circuits Conf. (VLSI), Kyoto, Japan, 13–19 June.
2020
[1] Steering Committee member; TPC member, track: “Frequency Generation,” R. B. Staszewski; IEEE European Solid-State Cir- cuits Conf. (ESSCIRC); Grenoble, France, 6–9 Sept. 2020. (Virtual)
[2] Quantum Computing Workshop (QCW) Thematic Track in conjunction with the International Conference on Computational Science (ICCS); R. B. Staszewski, Program Committee, Amsterdam, The Netherlands, 3–5 Jun. 2020. [Workshop link] [Conference link]
[3] 16th International Conference on Optical and Electronic Sensors (COE); R. B. Staszewski, International Advisory Board, Krakow, Poland, 29 Mar.–2 April. 2020.
2019
[1] Technical Program Committee (TPC) Chair; TPC member, track: “Frequency Generation,” R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Krakow, Poland, 23–25 Sept. 2019.
[2] Organizers: E. Charbon and F. Fahim, “Workshop on Cryogenic Electronics for Quantum Systems– (4 days) at Fermilab”, R. B. Staszewski, International Advisory Committee, Chicago, IL, US, 17–20 Sept. 2019.
[3] European Research Council (ERC) Consolidator Grant panel judge; R. B. Staszewski; IEEE Fellow Committee, Brussels, Belgium, Jun. 2019.
2018
[1] Organizers: G. Hueber and R. B. Staszewski, Workshop WS11 “Highly Integrated RF Transceiver Systems” (8-hrs) at IEEE European Microwave Conference (EuMC), Madrid, Spain, 23 Sept. 2018. [Workshop keynotes link]
2017
[1] IEEE Fellow Committee judge; R. B. Staszewski; IEEE Fellow Committee, Athens, Greece, Oct 2015; Las Vegas, AZ, USA, Oct 2016; Maui, HI, USA, Oct. 2017.
[2] Technical Program Committee (TPC) member, track: “Frequency Generation,” R. B. Staszewski; IEEE European Solid State Circuits Conf. (ESSCIRC); Leuven, Belgium, 11–14 Sept. 2017.
[3] Guest Editor, R. B. Staszewski, Journal of Solid-State Circuits (JSSC) Special Issue on European Solid-State Circuit Conferenc (ESSCIRC), RF section, July 2017. DOI: 10.1109/JSSC.2017.2711159. [IEEE Xplore link]
2016
[1] Organizers: R. B. Staszewski and G. Hueber, “Trends in CMOS RF ICs,” Workshop WW02 (8-hr, 8 speakers) organized at IEEE European Microwave Conference (EuMIC), London, UK, 05 Oct. 2016.
[2] Technical Program Committee (TPC) member, track: “Frequency Generation, ”R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Lausanne, Switzerland, 12–15 Sept. 2016.
2015
[1] Technical Program Committee (TPC) member, track: “Frequency Generation, ” R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Lausanne, Switzerland, 14–18 Sept. 2015.
[2] Organizers: G. Hueber, and R. B. Staszewski , “Micro and Nanowatt Smart RF Transceiver ICs for Internet of Things,” Workshop WMC (4-hr, 5 speakers) organized at IEEE Radio Frequency Integrated Circuits Symp. (RFIC), Phoenix, Arizona, USA, 18 May 2015.
[3] Organizers: H. Wang, R. B. Staszewski, and R. Winoto, “Mixed-Signal Power Amplifiers and RF-DACs,” Workshop WSE (8-hr, 8 speakers) organized at IEEE Radio Frequency Integrated Circuits Symp. (RFIC), Phoenix, Arizona, USA, 17 May 2015.
2014
[1] Technical Program Committee (TPC) member, track: “Frequency Generation,” R. B. Staszewski; IEEE European Solid-State Circuits Conf. (ESSCIRC); Venice, Italy, 22–26 Sept. 2014.
[2] Technical Program Committee (TPC) member, “Frequency Generation Circuits II (PLL, ADPLL, DDS, Dividers, Multipliers),” R. B. Staszewski; IEEE Radio Frequency Integrated Circuits Symposium (RFIC). Tampa, Florida, USA, 1–3 June 2014.
[3] Organizers: G. Hueber, and R. B. Staszewski, “How Digital Can RF Go?,” Workshop WSH (4-hr, 6 speakers) organized at IEEE Radio Frequency Integrated Circuits Symp. (RFIC), Tampa, Florida, USA, 1 June 2014.
[4] IEEE Fellow Committee evaluator; R. B. Staszewski; IEEE Fellow Committee 2014.
2013
[1] Organizer: R. B. Staszewski, “Tutorials on frequency synthesis,” Tutorial (6-hr, 6 speakers) organized at IEEE European Solid-State Circuits Conf. (ESSCIRC-2013), Bucharest, Romania, 16 Sept. 2013.
[2] Technical Program Committee (TPC) member, “Frequency Generation Circuits II (PLL, ADPLL, DDS, Dividers, Multipliers),” R. B. Staszewski; IEEE Radio Frequency Integrated Circuits Symposium (RFIC). Seattle, Washington, USA, 2–4 June 2013.
[3] Organizers: G. Hueber, and R. B. Staszewski, “Pushing the ultimate performance limits of RF CMOS,” Workshop WSD (8-hr, 8 speakers) organized at IEEE Radio Frequency Integrated Circuits Symp. (RFIC-2013), Seattle, Washington, USA, 2 June 2013.
2012
[1] Technical Program Committee (TPC) member: R. B. Staszewski; IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Sentosa Island, Singapore, 21–23 Nov. 2012.
[2] Organizers: G. Hueber, and R. B. Staszewski, “Digital-RF and Digitally-Enhanced Transceiver Architectures,” Workshop WsSu1F (8-hr, 6 speakers) organized at IEEE European Microwave Integrated Circuits Conference (EuMIC), Amsterdam, The Netherlands, 28 Oct. 2012.
[3] Organizers: G. Hueber, and R. B. Staszewski, “RF at the Nanoscale,” Workshop WSI (4-hr, 6 speakers) organized at IEEE Radio Frequency Integrated Circuits Symp. (RFIC-2012), Montreal, Quebec, Canada, 17 June 2012.
[4] Technical Program Committee (TPC) member, “Frequency Generation Circuits II (PLL, ADPLL, DDS, Dividers, Multipliers),” R. B. Staszewski; IEEE Radio Frequency Integrated Circuits Symposium (RFIC). Montreal, Quebec, Canada, 17–19 June 2012.
[5] Organizer: R. B. Staszewski; moderator: J. C. Rudell, “Is RF doomed to digitization? What shall RF circuit designers do?,” Panel (2-hr, 7 speakers) organized at IEEE Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, 20 Feb. 2012.
[6] Technical Program Committee (TPC) member; RF Subcommittee: R. B. Staszewski; IEEE Solid-State Circuits Conf.(ISSCC), San Francisco, CA, USA, Feb. {2008, 2009, 2010, 2011, 2012.
2011
[1] Session Chair: “M13: RF Circuits 1”, R. B. Staszewski, Session Chair (1.5-hr) organized at 20th IEEE European Conference on Circuit Theory and Design (ECCTD’11), Linkoping, Sweden, 29 Aug. 2011.
[2] Organizer: R. B. Staszewski, “What is the limit of multi-radio integration ... or rather, is it ’disintegration’?,” Panel organized (1-hr) at IEEE International Microwave Symp. (IMS-2011), Baltimore, MD, USA, 7 June 2011.
[3] Organizers: J. Khoja, O. Eliezer, and R. B. Staszewski, “Design for Manufacturability and Testability of RFICs,” Workshop WSH (8-hr, 8 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Baltimore, MD, USA, 5 June 2011.
[4] Organizers: G. Hueber, R. B. Staszewski, and S. Heinen, “Re-Configurability Requirements for Multi-Standard Low- Power Operation,” Workshop WSD (8-hr, 9 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Baltimore, MD, USA, 5 June 2011.
[5] Technical Program Committee (TPC) member, “Frequency Generation Circuits I: VCOs, Oscillators,” R. B. Staszewski; IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Baltimore, MD, USA, 5–7 June 2011.
[6] Organizing Committee Member, R. B. Staszewski, “Advanced transmitters forWireless Infrastructure,” Forum F1 (7-hr,7 speakers) at IEEE Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, 20 Feb. 2011.
2010
[1] Organizers: G. Hueber, R. B. Staszewski, and S. Heinen, “Re-configurable Multi-radios at the Nanoscale,” Workshop WSJ (8-hr, 10 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Anaheim, CA, USA, 23 May 2010.
[2] Organizer, co-chair: R. B. Staszewski; moderator, co-chair: J. C. Rudell, “Can RF SoCs (Self)Test Their Own RF?,” Evening Session ES5 (2-hr, 5 speakers) organized at IEEE Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, 9 Feb. 2010.
[3] Technical Program Committee (TPC) member, “Small-signal Circuits Subcommmittee,” R. B. Staszewski; IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Anaheim, CA, USA, 23–25 May 2010.
2009
[1] Technical Program Committee (TPC) member: R. B. Staszewski; IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Grand Capthorne Waterfront Hotel, Singapore, 9–11 Dec. 2009.
[2] Organizers: G. Hueber, R. B. Staszewski, and S. Heinen, “Challenges for Future RF Integration,” Workshop WSG (8-hr,8 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Boston, MA, USA, 7 June 2009.
2008
[1] Technical Program Committee (TPC) Chair: R. B. Staszewski; Terms: 2005, 2006, 2007 and 2008, IEEE Dallas Section of Circuits and Systems Society (CASS), Dallas, TX, USA.
[2] Technical Program Committee (TPC) Chair: R. B. Staszewski, Two-day Workshop (2 x 8-hr; 5 invited speakers: Kent Novak, Jayant Kulkarni, Kevin Novka, Larry Larson, Ken O; 7 refereed paper presentations & 11 refereed poster presentations), Seventh IEEE Dallas Circuits and Systems Workshop on SoC: Design, Application, Integration and Software (DCAS-08), The University of Texas at Dallas, Richardson, TX, USA, 19–20 Oct. 2008.
[3] Organizers: R. B. Staszewski, Y. Deval, and A. Maxim, “Analog-digital co-design techniques for nanometer CMOS transceiver SoC integration,” Workshop WSG (4-hr, 6 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Atlanta, GA, USA, 15 June 2008.
[4] Organizers: G. Hueber, R. B. Staszewski, and S. Heinen, “Adaptive low-power front-ends for wireless communication systems,” Workshop WSI (4-hr, 5 speakers) organized at IEEE Radio Frequency Integrated Circuits (RFIC) Symp., Atlanta, GA, USA, 15 June 2008.
[5] Organizing Committee Member, R. B. Staszewski, “Digitally-Assisted Analog & RF Circuits,” Forum F7 (9-hr, 7 speakers) at IEEE Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, 7 Feb. 2008.
[6] Technical Program Committee (TPC) member: B. Staszewski; XXVI IEEE International Conference on Computer Design (ICCD), Lake Tahoe, CA, USA, 12–15 Oct. 2008.
2007
[1] Technical Program Committee (TPC) member: R. B. Staszewski; IEEE International Workshop on Radio-Frequency Integration Technology (RFIT), Rasa Sentosa Resort, Singapore, 9–11 Dec. 2007.
[2] Technical Program Committee (TPC) Chair: R. B. Staszewski, Two-dayWorkshop (2 x 8-hr; 5 invited speakers: Dennis Buss, Michael Perrott, Kush Gulati, Ken Kundert, Bora Nikolic; 8 refereed paper presentations & 15 refereed poster presentations), Sixth IEEE Dallas Circuits and Systems Workshop on SoC: Design, Applications, Integration and Software (DCAS-07), Southern Methodist University, Dallas, TX, USA, 15–16 Nov. 2007.
2006
[1] Technical Program Committee (TPC) Chair: R. B. Staszewski, Two-day Workshop (2 x 8-hr; 5 invited speakers: Jan Rabaey, Yannis Tsividis, Bill Krenik, Boris Murmann, Michael Frank; 10 refereed paper presentations & 18 refereed poster presentations), Fifth IEEE Dallas Circuits and Systems Workshop: Design, Application, Integration and Software (DCAS-06), The University of Texas at Dallas, Richardson, TX, USA, 29–30 Oct. 2006.
[2] Editors: Kris Iniewski, R. B. Staszewski, and Mourad El-Gamal; Special issue of 2006 EURASIP Journal on Wireless Communications and Networking, “CMOS RF Circuits for Wireless Applications,” 2006.
2005
[1] Technical Program Committee (TPC) Chair: R. B. Staszewski, Full-day Workshop (8-hr; 5 speakers: Bill Krenik, Kaushik Roy, Vojin Oklobdzija, Kris Iniewski, Michael Keating; & refereed poster presentations), Fourth IEEE Dallas Circuits and Systems Workshop: Architecture, Circuits and Implementation of SoCs (DCAS-05), Radisson Hotel, Richardson, TX, USA, 10 Oct. 2005.